Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1998-03-31
2000-04-11
Niebling, John F.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438656, 438648, 438649, 438664, 438682, 438683, 438660, H01L 2144, H01L 214763
Patent
active
060487917
ABSTRACT:
A first TiSix layer is deposited on a polysilicon layer, then a silicon substrate is annealed in a vacuum atmosphere to crystallize the TiSix layer, and a second TiSix layer is provided on the first crystallized TiSix layer.
REFERENCES:
patent: 4783248 (1988-11-01), Kohlhase et al.
patent: 4784973 (1988-11-01), Stevens et al.
patent: 5070038 (1991-12-01), Jin
patent: 5138432 (1992-08-01), Stanasolovich et al.
patent: 5171412 (1992-12-01), Telieh et al.
patent: 5173450 (1992-12-01), Wei
patent: 5275715 (1994-01-01), Tuttle
patent: 5378660 (1995-01-01), Ngan et al.
patent: 5391520 (1995-02-01), Chen et al.
patent: 5451545 (1995-09-01), Ramaswami et al.
patent: 5504043 (1996-04-01), Ngan et al.
patent: 5510295 (1996-04-01), Cabral, Jr. et al.
patent: 5512516 (1996-04-01), Nishida et al.
patent: 5550079 (1996-08-01), Lin
patent: 5793111 (1998-08-01), Zamanian
Katata Tomio
Okumura Katsuya
Berezny Neal
Kabushiki Kaisha Toshiba
Niebling John F.
LandOfFree
Semiconductor device with electrode formed of conductive layer c does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device with electrode formed of conductive layer c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device with electrode formed of conductive layer c will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1176221