Semiconductor device with controlled spread polymeric underfill

Details Semiconductor device with controlled spread polymeric underfill Semiconductor device with controlled spread polymeric underfill

1991-12-23

1993-06-08

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257738, 257774, 257778, 257792, 361400, 361405, H01L 2328, H01L 2348, H01L 2946, H01L 2302

Patent

active

052182347

ABSTRACT:
A semiconductor device assembly comprises a semiconductor device (10) attached to a substrate (20). The substrate has a metallization pattern (22) on the surface and a polymeric film (24) covering most of the surface and the metallization pattern. A window-frame shaped opening (26) is created in the film, exposing portions of the substrate surface. The semiconductor device is attached to the substrate in such a manner that it lies in the interior perimeter (28) of the window-frame shaped opening in the film. An adhesive material (18) is applied to fill the space between the semiconductor device and the substrate. The window frame opening in the polymeric film serves to confine the adhesive to the area in the opening and underneath the device and prevents unwanted spread of the underfill material by forming an ideal fillet geometry. In another embodiment of the invention, the semiconductor device is in a package and the package is attached directly to the substrate.

REFERENCES:
patent: 4138691 (1979-02-01), Bonkohara et al.
patent: 4268848 (1981-05-01), Casey et al.
patent: 4280132 (1981-07-01), Hayakawa et al.
patent: 4843036 (1989-06-01), Schmidt et al.
patent: 5001542 (1991-03-01), Tsukagoshi et al.
patent: 5107325 (1992-04-01), Nakayoshi

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