Semiconductor device with conductive die attach material

Details Semiconductor device with conductive die attach material Semiconductor device with conductive die attach material

2007-09-20

2010-02-23

Prenty, Mark (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257SE23018

Reexamination Certificate

active

07667337

ABSTRACT:
A semiconductor device includes a carrier such as a lead frame, a semiconductor die and an attachment member affixing the semiconductor die to the carrier. The attachment device includes an electrically conductive organic material.

REFERENCES:
patent: 4834911 (1989-05-01), Carew
patent: 6352775 (2002-03-01), Sasaki et al.
patent: 6605236 (2003-08-01), Smith et al.
patent: 7189795 (2007-03-01), Burgoyne, Jr. et al.
patent: 7456504 (2008-11-01), Hamren et al.
patent: 2004/0225045 (2004-11-01), Forray
patent: 2005/0064194 (2005-03-01), Kumar et al.
patent: 69201159 (1995-11-01), None
patent: 9614642 (1996-05-01), None
patent: 9855532 (1998-12-01), None

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