Semiconductor device with coated semiconductor chip

Details Semiconductor device with coated semiconductor chip Semiconductor device with coated semiconductor chip

2005-09-06

2005-09-06

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S725000, C257S783000, C257S784000, C257S787000, C257S788000, C257S666000

Reexamination Certificate

active

06940184

ABSTRACT:
A semiconductor device includes a first lead having an inner portion on which a semiconductor chip is mounted, a second lead having an inner portion electrically connected to the semiconductor chip via a wire and a resin package for sealing the semiconductor chip and the wire. The inner portions, the semiconductor chip and the wire are coated with a coating film formed of amorphous fluororesin.

REFERENCES:
patent: 5128209 (1992-07-01), Sakai et al.
patent: 5170009 (1992-12-01), Kadokura
patent: 5482760 (1996-01-01), Takeuchi
patent: 6046075 (2000-04-01), Manteghi
patent: 6177726 (2001-01-01), Manteghi
patent: 6229688 (2001-05-01), Kobayashi et al.
patent: 6245259 (2001-06-01), Hohn et al.
patent: 04196601 (1992-07-01), None
patent: WO 96/37255 (1996-11-01), None

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