Semiconductor device with brazing mount

Details Semiconductor device with brazing mount Semiconductor device with brazing mount

1996-12-23

1999-06-29

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

257 99, 257731, H01L 2348

Patent

active

059172452

ABSTRACT:
A mount 2 is secured on a circuit board 1 to support a diode chip 3 thereon. A plurality of legs 7, 12 formed in the mount 2 are in contact with an electrode 4 on the circuit board 1 to form at least a dent 14. The mount 2 also has an inclined surface 8 formed at the periphery which faces the electrode 4. Solder 9 is filled in the dent 14 between the legs 7, 12 and in the flaring area 13 between the circuit board 1 and the inclined surface 8 of the mount 2 to prevent exfoliation or detachment of the mount from the electrode 4.

REFERENCES:
patent: 3434018 (1969-03-01), Boczar et al.
patent: 3740617 (1973-06-01), Teramoto et al.
patent: 3813587 (1974-05-01), Umeda et al.
patent: 4862247 (1989-08-01), Dayberry et al.
patent: 5298768 (1994-03-01), Okazaki et al.
patent: 5310701 (1994-05-01), Kaussen et al.
patent: 5410451 (1995-04-01), Hawthorne et al.
Patent Abstracts of Japan vol. 096, No. 002, Feb. 29, 1996 & JP 07273258 A (Mitsubishi Electric Corp), Oct. 20 1995.
Patent Abstracts of Japan vol. 012, No. 177, (E-613), May 25, 1988 & JP 62 283648 A (Matsushita Electronic Corp), Sep. 9, 1987.
Patent Abstracts of Japan vol. 011, No. 271 (E-536), Sep. 3, 1987 & JP 62 072147A (Toshiba Corp), Apr. 2, 1987.
Patent Abstracts of Japan, vol. 008, No. 059 (E-232), Mar. 17, 1984 & JP 58 210643 A (Mitsubishi Denki KK), Dec. 7, 1993.

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