Semiconductor device with an analog capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S314000, C257S316000, C438S257000, C438S593000

Reexamination Certificate

active

11145460

ABSTRACT:
A method for manufacturing a semiconductor device that comprises forming an oxide layer over a substrate. A polysilicon layer is disposed outwardly from the oxide layer, wherein the polysilicon layer forms a floating gate. A PSG layer is disposed outwardly from the polysilicon layer and planarized. The device is pattern etched to form a capacitor channel, wherein the capacitor channel is disposed substantially above the floating gate formed from the polysilicon layer. A dielectric layer is formed in the capacitor channel disposed outwardly from the polysilicon layer. A tungsten plug operable to substantially fill the capacitor channel is formed.

REFERENCES:
patent: 4811076 (1989-03-01), Tigelaar et al.
patent: 5376572 (1994-12-01), Yang et al.
patent: 6037625 (2000-03-01), Matsubara et al.
patent: 6117732 (2000-09-01), Chu et al.
patent: 6495419 (2002-12-01), Ahmed et al.
patent: 6569740 (2003-05-01), Smith
Wolf, S., “Silicon Processing for the VLSI Era,” vol. 2—Process Integration, 1990, section 4.4.1,2, pp. 201-204 and section 4.5.4.2, pp. 247-251.

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