Semiconductor device with a recessed bond pad

Details Semiconductor device with a recessed bond pad Semiconductor device with a recessed bond pad

2006-02-07

2008-08-05

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

Mesa structure

C257S774000, C257S786000, C257SE23037, C361S767000, C438S612000

Reexamination Certificate

active

07408241

ABSTRACT:
A semiconductor device with surface-mountable outer contacts and to a process for producing it is disclosed. In one embodiment, surface-mountable outer contacts are arranged on outer contact connection surfaces on the underside of the semiconductor device. In their respective center region, the outer contact connection surfaces have at least one recess which has a dovetail-like profile, the areal extent of the recess being smaller than the maximum cross section of an outer contact. In a one process, the recess in the center region is achieved by selective deposition of correspondingly patterned metal layers.

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patent: 10352349 (2005-06-01), None

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