Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2006-09-25
2010-11-09
Nguyen, Tai T (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257S795000, C257SE23010, C257SE23116, C257SE23135, C438S126000, C438S127000
Reexamination Certificate
active
07830026
ABSTRACT:
A semiconductor device with plastic housing composition includes an internal wiring that is electrically insulated from the plastic housing composition by an insulation layer. The plastic housing composition has a high thermal conductivity and a low coefficient of expansion, the coefficient of expansion being adapted to the semiconductor chip of the semiconductor device. This is achieved by forming the plastic housing composition with electrically semiconducting and/or electrically conducting filler particles. In particular, this plastic housing composition is advantageously used for semiconductor devices with flip-chip contacts and/or for semiconductor devices which are constructed according to the “universal packaging concept”.
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Beer Gottfried
Fuergut Edward
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
Nguyen Tai T
LandOfFree
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