Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2011-01-11
2011-01-11
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257SE23010, C257SE21505, C257S685000, C257S723000, C257S784000, C257S786000, C257S712000, C257S713000, C257S717000, C257S720000, C257S676000
Reexamination Certificate
active
07868465
ABSTRACT:
A semiconductor device is disclosed. One embodiment provides a device including a carrier, an electrically insulating layer applied onto the carrier, an adhesive layer applied to the electrically insulating layer. A first semiconductor chip applied to the adhesive layer.
REFERENCES:
patent: 5544412 (1996-08-01), Romero et al.
patent: 5686758 (1997-11-01), Arai et al.
patent: 6132865 (2000-10-01), Oka et al.
patent: 6407411 (2002-06-01), Wojnarowski et al.
patent: 6436732 (2002-08-01), Ahmad
patent: 6756689 (2004-06-01), Nam et al.
patent: 6992380 (2006-01-01), Masumoto
patent: 7157791 (2007-01-01), Lin
patent: 2004/0125579 (2004-07-01), Konishi et al.
patent: 2004/0189229 (2004-09-01), Nadd et al.
patent: 2005/0040522 (2005-02-01), Takehara et al.
patent: 2005/0051356 (2005-03-01), Sumi et al.
patent: 2006/0033122 (2006-02-01), Pavier et al.
patent: 2006/0056213 (2006-03-01), Lee et al.
patent: 2006/0225918 (2006-10-01), Chinda et al.
patent: 2008/0258277 (2008-10-01), Hosseini et al.
patent: 2837300 (1980-03-01), None
patent: 19626100 (1997-12-01), None
patent: 10030427 (2002-01-01), None
patent: 10122191 (2002-08-01), None
patent: 10117775 (2002-10-01), None
patent: 102004040773 (2005-05-01), None
patent: 102004026159 (2006-02-01), None
patent: 2006-318980 (2006-11-01), None
Engl Reimund
Fischer Rupert
Mahler Joachim
Otremba Ralf
Rakow Bernd
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
Williams Alexander O
LandOfFree
Semiconductor device with a metallic carrier and two... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device with a metallic carrier and two..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device with a metallic carrier and two... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2686405