Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate
2005-08-23
2005-08-23
Clark, Jasmine (Department: 2815)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
C438S464000, C438S113000, C438S114000, C438S115000, C438S259000, C438S270000
Reexamination Certificate
active
06933211
ABSTRACT:
A semiconductor element is formed in the major surface of a semiconductor chip. Curved surfaces having a radius of curvature of 0.5 to 50 μm are formed at at least some of edges where the side surfaces and backside surface of the semiconductor chip cross.
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Clark Jasmine
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
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