Semiconductor device using gold bumps and copper leads as bondin

Details Semiconductor device using gold bumps and copper leads as bondin Semiconductor device using gold bumps and copper leads as bondin

1997-05-09

2000-04-11

Abraham, Fetsum

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257736, 257737, 257738, 257762, 257748, 257772, 257778, 438119, 438120, 438613, 438665, H01L 2348, H01L 2352

Patent

active

060491302

ABSTRACT:
A semiconductor device comprises a semiconductor chip, an Au bump formed on the semiconductor chip, and Cu lead bonded to the Au bump through a bonding part. The Cu lead has a Cu core and a plated Sn layer formed on the Cu core, and the bonding part is formed of an Au-rich Au--Cu--Sn alloy of a ternary system having a single-phase structure containing 15 at. % or less Sn and 25 at. % or less Cu.

REFERENCES:
patent: 4634638 (1987-01-01), Ainslie et al.
patent: 5463245 (1995-10-01), Hiruta
patent: 5545589 (1996-08-01), Tomura et al.
patent: 5747881 (1998-05-01), Hosomi et al.
Hosomi, E. et al., "A New Bonding Mechanism of 50 .mu.m Pitch TAB-ILB with 0.25 .mu.m Sn Plated Cu Lead" Proceedings of the Electronic Components & Technology Conference, Las Vegas, Nevada, May 21-24, 1995, pp. 851-856.
Lai, J.K.L., et al., "Effects of Bond Temperature and Pressure on Microstructures of Tape Automated Bonding (TAB) Inner Lead Bonds (ILB) with Thin Tape Metallization," Proceedings of the Electronic Components & Technology Conference, Las Vegas, Nevada, May 21-24, 1995, pp. 819-826.
Zakel, E. et al., "Degradation of TAB Outer Lead Contacts Due to the Au-Concentration in Eutectic Tin/Lead Solder," Proceedings of the Japan International Electronic Manufacturing Technology Symposium, Kanazawa, Japan, Jun. 9-11, 1993 pp. 322-329.
Zakel, E. et al., "Au-SN Bonding Metallurgy of TAB Contracts and Its Influence on the Kirkendall Effect in the Ternary Cu-Au-Sn System," Proceedings of the Electronic Components & Technology Conference, San Diego, CA, May 18-20, 1992, pp. 360-371.
Zakel, E. et al., "Investigations of Failure Mechanisms of Tab-Bonded Chips During Thermal Aging," Proceedings of the Electronic Components & Technology Conference, Las Vegas, Nevada, May 20-23, 1990 pp. 450-459.

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