Semiconductor device test patterns and related methods for...

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

Reexamination Certificate

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C257S314000, C257SE21522

Reexamination Certificate

active

10796672

ABSTRACT:
Semiconductor device test patterns are provided that include a word line on a semiconductor substrate and an active region having a first impurity doped region and a second impurity doped region in at the semiconductor substrate. A first self-aligned contact pad is electrically connected to the first impurity doped region, and a first direct contact is electrically connected to the first self-aligned contact pad. A first bit line is electrically connected to the first direct contact, and a first probing pad is electrically connected to the first bit line. The test pattern further includes a second self-aligned contact pad that is electrically connected to the second impurity doped region, and a second direct contact electrically connected to the second self-aligned contact pad. A second conductive line is electrically connected to the second direct contact, and a second probing pad is electrically connected to the second conductive line. These test patterns may be used to measure leakage current in a cell transistor of the semiconductor device.

REFERENCES:
patent: 5625591 (1997-04-01), Kato et al.
patent: 6055655 (2000-04-01), Momohara
patent: 2002/0060332 (2002-05-01), Ikeda et al.
patent: 2003/0001179 (2003-01-01), Takeuchi
Young Pil Kim et al., “Reliability Degradation of High Density DRAM Cell Transistor Junction Leakage Current Induced by Band-to-Defect tunneling Under the Off-State Bias-Temperature Stress,”IEEE, 2001.
K. Saino et al., “Impact of Gate-Induced Drain Leakage Current on the Tail Distribution of DRAM Data Retention Time,”IEEE, 2000.

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