Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2007-04-03
2007-04-03
Potter, Roy Karl (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S778000
Reexamination Certificate
active
11053351
ABSTRACT:
Semiconductor device structures include protective layers that are formed from healable or healed materials. The healable materials are configured to eliminate cracks and delamination, including singulation-induced cracks and delamination. The protective layers may be formed by applying a layer of protective material to surfaces of semiconductor device components that are carried by a fabrication substrate. The layer of protective material is then severed and the fabrication substrate is at least partially severed. Cracks and delaminated regions that are formed during severing are then healed. If a curable polymer is employed as the protective material, it may be partially cured before severing is effected, then self-healed before being fully cured. Alternatively, a thermoplastic material may be used as the protective material, with healing being effected by heating at least regions of the thermoplastic material.
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Hinkle S. Derek
Jiang Tongbi
Luo Shijian
Micro)n Technology, Inc.
Potter Roy Karl
TraskBritt
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