Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2005-12-20
2005-12-20
Whitehead, Jr., Carl (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S786000, C257S789000
Reexamination Certificate
active
06977442
ABSTRACT:
A semiconductor device includes a conductive layer with a plurality of wires, and a bonding pad formed in a region overlapping with the plurality of wires of the conductive layer. One of the wires is connected to the bonding pad, and an insulating protective film is formed between the remaining wires and the bonding pad. The protective film is bridged between adjacent wires at least in a region overlapping with the bonding pad. As a result, the protective film on the wires forms a bridge structure, which is effective in preventing cracking at a lower portion of the protective film. Further, a void formed underneath the bridged portion serves as an air spring to prevent damage to the structural elements, such as the wires, formed under the protective film. Further, because a polyimide film, which serves as a shock absorber, is not required, working efficiency can be improved and chip cost can be reduced.
REFERENCES:
patent: 5565378 (1996-10-01), Harada et al.
patent: 5989991 (1999-11-01), Lien
patent: 6538326 (2003-03-01), Shimizu et al.
Akagawa Masafumi
Horio Masahiro
Huynh Yennhu B.
Jr. Carl Whitehead
Sharp Kabushiki Kaisha
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