Semiconductor device socket

Details Semiconductor device socket Semiconductor device socket

2007-06-12

2007-06-12

Lea-Edmonds, Lisa (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C439S073000, C439S331000, C439S330000, C439S259000, C439S226000, C439S487000, C439S266000, C257S718000, C257S719000, C324S760020, C324S765010

Reexamination Certificate

active

11106461

ABSTRACT:
In a state wherein front ends of latch members18A and18B are apart from each other so that the upper surface of an alignment plate/positioning member24is outside, a pressing section12PU of a heat sink member12is brought into contact with the periphery of a semiconductor device22.

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Co-Pending U.S. Appl. No. 11/212,706; Title: Method of Mounting and Demounting a Semiconductor Device, Device for Mounting and Demounting a Semiconductor Device Using the Same, and Socket for Semiconductor Device; U.S. Filing Date: Aug. 29, 2005.
Co-Pending U.S. Appl. No. 11/448,900, Title: Socket for Semiconductor Device, filed Jun. 8, 2006.
Co-Pending U.S. Appl. No. 11/448,899, Title: Socket for Semiconductor Device, filed Jun. 8, 2006.
Co-Pending U.S. Appl. No. 11/448,873, Title: Socket for Semiconductor Device, filed Jun. 8, 2006.

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