Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2009-03-09
2010-12-14
Luu, Chuong A (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S458000, C257SE21596
Reexamination Certificate
active
07851264
ABSTRACT:
The objective of the invention is to provide a semiconductor device manufacturing method with which the generation of burrs can be suppressed while increasing the singulation speed of the package. In a manufacturing method of a QFN package of the present invention, a molding prepared by sealing a lead frame with plural semiconductor chips carried on it en bloc with a resin; the operation comprises the following processing steps: a first singulation processing step S101in which the molding is half-cut along the cutting plane; a de-flashing processing step S102in which the burrs on the cut portion of the half-cut molding are removed; and a second singulation processing step S103in which the de-flashed molding is completely cut along the cutting plane.
REFERENCES:
patent: 2005/0116321 (2005-06-01), Li et al.
patent: 2005/0263864 (2005-12-01), Islam et al.
patent: 2006/0097366 (2006-05-01), Sirinorakul et al.
Brady III Wade J.
Doan Nga
Luu Chuong A
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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