Semiconductor device singulation method

Details Semiconductor device singulation method Semiconductor device singulation method

2009-03-09

2010-12-14

Luu, Chuong A (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S458000, C257SE21596

Reexamination Certificate

active

07851264

ABSTRACT:
The objective of the invention is to provide a semiconductor device manufacturing method with which the generation of burrs can be suppressed while increasing the singulation speed of the package. In a manufacturing method of a QFN package of the present invention, a molding prepared by sealing a lead frame with plural semiconductor chips carried on it en bloc with a resin; the operation comprises the following processing steps: a first singulation processing step S101in which the molding is half-cut along the cutting plane; a de-flashing processing step S102in which the burrs on the cut portion of the half-cut molding are removed; and a second singulation processing step S103in which the de-flashed molding is completely cut along the cutting plane.

REFERENCES:
patent: 2005/0116321 (2005-06-01), Li et al.
patent: 2005/0263864 (2005-12-01), Islam et al.
patent: 2006/0097366 (2006-05-01), Sirinorakul et al.

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