Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2008-03-28
2010-02-16
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S783000, C257SE23101, C257S778000
Reexamination Certificate
active
07663251
ABSTRACT:
A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the elongate opening. The electrode of the semiconductor chip is electrically connected to the connecting pattern via wires through the elongate opening. The elongate opening and the wires are sealed with resin.
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IBM Technical Disclosure Bulletin, vol. 24, No. 6, dated Nov. 1981, pp. 3017-3018, entitled “Vacuum Wafer Pick-Up Tip,” by J.G. Ferrentino and L.H. Rosenfeld.
Oki Semiconductor Co., Ltd.
Potter Roy K
Volentine & Whitt P.L.L.C.
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