Semiconductor device, semiconductor module and hard disk

Details Semiconductor device, semiconductor module and hard disk Semiconductor device, semiconductor module and hard disk

2005-08-23

2005-08-23

Whitehead, Jr., Carl (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S251000, C257S712000, C257S718000, C257S719000, C257S675000, C257S796000, C257S707000, C438S122000

Reexamination Certificate

active

06933604

ABSTRACT:
The back surface of a semiconductor chip (16) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this semiconductor chip (16). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially within a same plane, so that it is readily affixed to a second supporting member (24). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the metal plate (23) and the second supporting member (24).

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