Semiconductor device sealed in a resin section and method...

Details Semiconductor device sealed in a resin section and method... Semiconductor device sealed in a resin section and method...

2011-04-26

2011-04-26

Sefer, A. (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S782000, C257S787000, C257SE23141

Reexamination Certificate

active

07932616

ABSTRACT:
A semiconductor device includes a first semiconductor chip having a pad electrode formed on an upper surface thereof; a resin section sealing the first semiconductor chip with the upper surface and a side surface of the first semiconductor chip being covered and a lower surface of the first semiconductor chip being exposed; a columnar electrode communicating between the upper surface and the lower surface of the resin section with the upper surface and the lower surface of the columnar electrode being exposed on the resin section and at least a part of the side surface of the columnar electrode being covered; and a bonding wire connecting the pad electrode and the columnar electrode with a part of the bonding wire being embedded in the columnar electrode as one end of the bonding wire being exposed on the lower surface of the columnar electrode and the remaining part of the bonding wire being covered with the resin section, and a method for manufacturing the same.

REFERENCES:
patent: 5900676 (1999-05-01), Kweon et al.
patent: 6838768 (2005-01-01), Corisis et al.
patent: 6936929 (2005-08-01), Mostafazadeh et al.
patent: 2004/0155324 (2004-08-01), Sasaki
patent: 11-297880 (1999-10-01), None

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