Semiconductor device, resin for sealing same and method of fabri

Details Semiconductor device, resin for sealing same and method of fabri Semiconductor device, resin for sealing same and method of fabri

1993-06-18

1995-07-04

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

257789, 257795, C08G 5922

Patent

active

054303303

ABSTRACT:
A semiconductor device where electrode terminals (2), elements (6) and wires (7) are disposed on a base plate (5) of a case (4) filled with only epoxy resin (1). The epoxy resin (1) contains impurities such as halogen and alkaline metallic salts in an amount of not more than 5 ppm and has a linear expansion coefficient of 5.times.10.sup.-6 to 25.times.10.sup.-6 when hardened. The semiconductor device provides for direct sealing of the components, its size and cost are therefore reduced.

REFERENCES:
patent: 4043969 (1977-08-01), Sporck
patent: 4884126 (1989-11-01), Harada et al.
patent: 5298548 (1994-03-01), Shiobara et al.
Patent Abstracts of Japan, vol. 11, No. 20 (E-472), Jan. 20, 1987, JP-A-61 191 056, Aug. 25, 1986.
Patent Abstracts of Japan, vol. 15, No. 348, (E-1107), Sep. 4, 1991, JP-A-03 135 039, Jun. 10, 1991.

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