Semiconductor device, production method thereof, and tape carrie

Details Semiconductor device, production method thereof, and tape carrie Semiconductor device, production method thereof, and tape carrie

1996-04-04

1998-09-29

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257778, 257792, 528310, 528318, H01L 2328

Patent

active

058148949

ABSTRACT:
A semiconductor device capable of preventing the occurrence of defect of electroconductivity, wherein a semiconductor chip 1 equipped with electrodes 11 is mounted on an auxiliary wiring plate 2 in the state of facing the surface of the electrode 11 side, leading conductors 23 are disposed in the inside of the auxiliary wiring plate 2, one end of each leading conductor 23 forms an internal electrode 21 projecting from the surface of the auxiliary wiring plate 2 at the side of mounting the semiconductor chip 1, the other end of the leading conductor 23 forms an external electrode 22 projecting from the surface of the auxiliary wiring plate opposite to the side of mounting the semiconductor chip 1, and each of the internal electrodes 21 is connected to each of the electrodes 11 of the semiconductor chip 1, at least a gap between the semiconductor chip 1 and the auxiliary wiring plate 2 is encapsulated with a heat-welding polyimide resin layer.

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patent: 5656863 (1997-08-01), Yasunaga et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5684330 (1997-11-01), Lee

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