Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate
2011-08-02
2011-08-02
Lee, Eugene (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
With shielding
C257S660000, C257S708000, C257S728000, C257SE23114, C029S412000, C029S841000, C029S845000, C029S852000, C361S816000
Reexamination Certificate
active
07989928
ABSTRACT:
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
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Chiu et al., “Semiconductor Device Packages With Electromagnetic Interference Shieldin
Chiu Chi-Tsung
Hung Chih-Pin
Liao Kuo-Hsien
Advanced Semiconductor Engineering Inc.
Cooley LLP
Gumedzoe Peniel M
Lee Eugene
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