Semiconductor device package side-by-side stacking and mounting

Details Semiconductor device package side-by-side stacking and mounting Semiconductor device package side-by-side stacking and mounting

1994-05-02

1997-04-08

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257704, 257723, 257730, 257731, 361730, 361735, 361740, H01L 2304, H01L 2332

Patent

active

056190670

ABSTRACT:
The invention is to an array of stacked devices utilizing vertical surface mounted semiconductor devices stacked side by side and inserting the stack of devices into a casing. The packaged stack of devices creates a cube package which is capable of replacing SIMM boards, and saves considerable space. The casing dissipates heat generated in the devices, and may be of metal or thermally conductive plastic.

REFERENCES:
patent: Re34794 (1994-11-01), Farnworth
patent: 4656605 (1987-04-01), Clayton
patent: 4667270 (1987-05-01), Yagi
patent: 4706166 (1987-11-01), Go
patent: 4975763 (1990-12-01), Baudouin et al.
patent: 5109317 (1992-04-01), Miyamoto et al.
patent: 5279029 (1994-01-01), Burns
patent: 5349235 (1994-09-01), Lee et al.
patent: 5362986 (1994-11-01), Angiulli et al.
patent: 5413970 (1995-05-01), Russell

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