Semiconductor device package side-by-side stacking and mounting

Details Semiconductor device package side-by-side stacking and mounting Semiconductor device package side-by-side stacking and mounting

1996-01-16

1997-09-02

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438117, 29832, H01L 2160

Patent

active

056631057

ABSTRACT:
The invention is to an array of stacked devices utilizing vertical surface mounted semiconductor devices stacked side by side and inserting the stack of devices into a casing. The packaged stack of devices creates a cube package which is capable of replacing SIMM boards, and saves considerable space. The casing dissipates heat generated in the devices, and may be of metal or thermally conductive plastic.

REFERENCES:
patent: Re34794 (1994-11-01), Farnworth
patent: 4706166 (1987-11-01), Go
patent: 4967262 (1990-10-01), Farnsworth
patent: 5109317 (1992-04-01), Miyamoto et al.
patent: 5413970 (1995-05-01), Russell

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