Semiconductor device package having buffered memory module...

Details Semiconductor device package having buffered memory module... Semiconductor device package having buffered memory module...

2005-01-13

2010-10-26

Le, Thao X (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S686000, C257S777000, C257SE25010, C438S107000, C438S109000, C438S110000

Reexamination Certificate

active

07821127

ABSTRACT:
A method and apparatus of fabricating a semiconductor device are disclosed. The semiconductor device may include a buffer chip package having a buffer chip mounted on a buffer chip substrate and at least one memory package mounted on the buffer chip substrate, wherein the at least one memory package may include a plurality of memory chips. Further, the buffer chip package may have a plurality of external connection terminals.

REFERENCES:
patent: 5099309 (1992-03-01), Kryzaniwsky
patent: 5517057 (1996-05-01), Beilstein, Jr. et al.
patent: 6597062 (2003-07-01), Li et al.
patent: 6717275 (2004-04-01), Matsuura et al.
patent: 2002/0030261 (2002-03-01), Rolda et al.
patent: 2003/0199119 (2003-10-01), Lin
patent: 10-284683 (1998-10-01), None
patent: 2002-0095061 (2002-12-01), None
patent: 2003-0036130 (2003-05-01), None

Affiliated with

Also associated with

Rating

Semiconductor device package having buffered memory module... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device package having buffered memory module..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device package having buffered memory module... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4161318