Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Patent
1990-06-25
1992-12-22
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
257668, H05K 118
Patent
active
051737663
ABSTRACT:
A semiconductor device package and a method of making such a package is described. The package comprises a flexible packaging substrate having a patterned metal layer onto which a semiconductor die is attached and a patterned insulative layer attached to the metal layer. The insulative layer includes an annular epoxy-seal gap. A glob of silicone gel is deposited and cured on the die. A casting frame is connected to the metal layer of the flexible substrate on the same side as the die. A backside moisture-blocking layer of material is attached to an opposed side of the tape. The frame and the backside layer are attached to the metal layer of the flexible substrate using cross-linkable epoxy adhesives. These epoxy adhesives join through the epoxy-seal gap to define an epoxy-seal around the die. A thermoset type of molding compound is then poured into the casting frame to define a moisture resistant package body.
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Long Jon M.
Murphy Adrian
Sen Bidyut
Sidorovsky Rachel S.
Steidl Michael J.
James Andrew J.
LSI Logic Corporation
Nguyen Viet Q.
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