Semiconductor device package and method

Details Semiconductor device package and method Semiconductor device package and method

1997-10-02

2000-03-21

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257668, 257706, H01L 2348

Patent

active

060406240

ABSTRACT:
A chip scale power semiconductor device (16) provides improved heat dissipation. A semiconductor die (19) is mounted in a first region of a substrate (18). The substrate is extended to a second region for disposing terminals (38) to make external connections to the semiconductor device. Conductors (34) formed on the substrate electrically couple the semiconductor die to the terminals. The substrate is extended for a predetermined distance to separate the second region from the first region for isolating the temperature of the semiconductor die from the local temperature at the terminals.

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