Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1997-07-16
2000-11-14
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257690, 257692, 257693, 257700, H01L 2348, H01L 2352, H01L 23053, H01L 2312
Patent
active
061473987
ABSTRACT:
A packaging structure is capable of electrically connecting an external lead to a pad of a semiconductor chip by directly bonding the external lead to the pad of the semiconductor chip without an adhesive, which requires no resin sealing. The packaging structure comprises a lead member 20 having an fitting part with a U-shaped cross section, which can be fit into the semiconductor chip 10 from the end part thereof, and the fitting part pinches the semiconductor chip by means of an elastic restoration force or a plastic deformation, thereby allowing a contact point 20a at one end of the lead member 20 to directly bring into contact with the pad part 11 of the semiconductor chip and, at the same time, the fitting part is provided with a construction for insulating the lead member from the semiconductor chip in the internal circumference except for the contact point. The plurality of lead members 20 are arranged and fixed in a predetermined interval in a longitudinal direction to be integrated each other through the aforementioned insulating layer 30 to constitute an integrated member 100 which can be fit into the aforementioned semiconductor chip from the peripheral edge thereof.
REFERENCES:
patent: 5081520 (1992-01-01), Yoshii et al.
patent: 5224021 (1993-06-01), Takada et al.
patent: 5397916 (1995-03-01), Normington
patent: 5413970 (1995-05-01), Russell
patent: 5663596 (1997-09-01), Little
patent: 5801439 (1998-09-01), Fujisawa et al.
Nakazato Noriyuki
Yamasaki Kyoji
Mitsubishi Denki & Kabushiki Kaisha
Saadat Mahshid
Wilson Allan R.
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