Semiconductor device package

Details Semiconductor device package Semiconductor device package

1995-09-13

1996-12-17

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257676, 257696, 361813, 361820, H01L 2352, H01L 23495

Patent

active

055856705

ABSTRACT:
Disclosed herein is a semiconductor device package including a ground frame formed of a metal plate. The ground frame has a rectangular central portion, four legs integrally extending outward from the four corners of the central portion, and four grounding lead terminals formed integrally with the outer ends of the four legs. The width of each grounding lead terminal including a grounding portion is set to about three to five times the width of each lead terminal. The outer end of each grounding lead terminal is slightly projected outward from the outer end of each lead terminal. Accordingly, a stable ground potential can be ensured, and deformation of each lead terminal can be reliably prevented.

REFERENCES:
patent: 4331831 (1982-05-01), Ingram et al.
patent: 5041901 (1991-08-01), Kitano et al.
patent: 5117068 (1992-05-01), Seieroe et al.
patent: 5153379 (1992-10-01), Guzuk et al.
patent: 5196725 (1993-03-01), Mita et al.
patent: 5235207 (1993-08-01), Ohi et al.
patent: 5309018 (1994-05-01), Shibata
patent: 5367124 (1994-11-01), Hoffman et al.
patent: 5466967 (1995-11-01), Westerkamp

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