Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-11-06
2010-02-16
Le, Thao P. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S672000
Reexamination Certificate
active
07663217
ABSTRACT:
Provided is a semiconductor device package. The semiconductor device package includes: stacked semiconductor chips having bonding pads; a PCB (printed circuit board) mounting the stacked semiconductor chips thereon, and including bonding electrodes that correspond to the bonding pads; and interposers respectively covering the stacked semiconductor chips and interposed between the stacked semiconductor chips. The interposers comprise wire patterns connecting the bonding pads with the bonding electrodes, and connecting the interposers to each other.
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English language abstract of Japanese Publication No. 2002-50737.
English language abstract of Japanese Publication No. 2002-289769.
English language abstract of Korean Publication No. 10-2005-0104960.
Eun Hyung-Lae
Han Sang-Jib
Kim Byung-Jo
Le Thao P.
Myers Bigel Sibley & Sajovec P.A.
Samsung Electronics Co,. Ltd.
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