Semiconductor device of chip-on-chip structure, assembling...

Details Semiconductor device of chip-on-chip structure, assembling... Semiconductor device of chip-on-chip structure, assembling...

2007-12-11

2007-12-11

Rose, Kiesha (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

Reexamination Certificate

active

11150129

ABSTRACT:
A semiconductor device including a first semiconductor chip, a second semiconductor chip bonded to the first semiconductor chip in a stacked relation, and a registration structure which causes the first and second semiconductor chips to be positioned with respect to each other by depression-projection engagement therebetween. The registration structure includes, for example, a registration recess provided on a surface of the first semiconductor chip, and a registration projection provided on a surface of the second semiconductor chip for engagement with the registration recess. The registration projection may be a spherical member provided on the surface of the second semiconductor chip.

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