Semiconductor device, noise reduction method, and shield cover

Details Semiconductor device, noise reduction method, and shield cover Semiconductor device, noise reduction method, and shield cover

2008-03-18

2008-03-18

Dinh, Tuan T. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S753000, C361S816000, C361S800000, C361S799000, C174S350000, C333S012000

Reexamination Certificate

active

07345892

ABSTRACT:
In a memory module, reference potential connecting patterns are disposed on high frequency signal lines and/or on the extension lines extending from the terminal ends of the signal lines as well as a shield cover for covering semiconductor memory chips is disposed on the substrate, and the reference potential connecting patterns are connected to the shield cover through metal cover contact parts.

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