Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation
Reexamination Certificate
2006-12-08
2008-10-28
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
Insulated gate formation
C438S530000, C257SE21177
Reexamination Certificate
active
07442632
ABSTRACT:
In a semiconductor device including a semiconductor substrate, and an n-channel type MOS transistor produced in the semiconductor substrate, the n-channel type MOS transistor includes a gate insulating layer formed on the semiconductor substrate and having a thickness of at most 1.6 nm, and a gate electrode layer on the gate insulating layer, and the gate electrode layer is composed of polycrystalline silicon which has an average grain size falling within a range between 10 nm and 150 nm in the vicinity of the gate insulating layer.
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Suzuki Takayuki
Togo Mitsuhiro
Ahmadi Mohsen
Geyer Scott B.
McGinn IP Law Group PLLC
NEC Electronics Corporation
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