Semiconductor device mounting structure for reducing thermal...

Details Semiconductor device mounting structure for reducing thermal... Semiconductor device mounting structure for reducing thermal...

2008-01-08

2008-01-08

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S737000, C257S775000, C257S776000, C257S778000, C257SE21530, C257SE23069

Reexamination Certificate

active

07317254

ABSTRACT:
A semiconductor device is composed of a circuit board, a semiconductor chip connected with the circuit board by a plurality of bumps. The semiconductor chip includes a center portion and a peripheral portion surrounding the center portion. The peripheral portion has a thickness smaller than that of the center portion.

REFERENCES:
patent: 6025648 (2000-02-01), Takahashi et al.
patent: 6657311 (2003-12-01), Hortaleza et al.
patent: 6731012 (2004-05-01), Brodsky et al.
patent: 2003/0052417 (2003-03-01), Hosaka
patent: 11-345823 (1999-12-01), None
patent: 2000-260811 (2000-09-01), None
patent: 2004-63515 (2004-02-01), None

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