Semiconductor device mounting method, semiconductor device...

Details Semiconductor device mounting method, semiconductor device... Semiconductor device mounting method, semiconductor device...

2007-02-20

2007-02-20

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257SE23021, C257SE23060, C257S785000, C257S690000

Reexamination Certificate

active

10644603

ABSTRACT:
A wiring terminal is formed on a wiring substrate, and an electrode is formed on a semiconductor device. The width of the wiring terminal is smaller than the width of the electrode. When the semiconductor device is mounted on the wiring substrate, the wiring terminal becomes embedded in the electrode due to applied pressure.

REFERENCES:
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5457879 (1995-10-01), Gurtler et al.
patent: 5592365 (1997-01-01), Sugimoto et al.
patent: 6137063 (2000-10-01), Jiang
patent: 6172422 (2001-01-01), Chigawa
patent: 6356333 (2002-03-01), Uchiyama
patent: 6555415 (2003-04-01), Hedler
patent: 6713844 (2004-03-01), Tatsuta et al.
patent: 2002/0089057 (2002-07-01), Ikegami
patent: 60-49638 (1985-03-01), None
patent: 8-031864 (1996-02-01), None
patent: 09-260424 (1997-10-01), None
patent: 11-251363 (1999-09-01), None
patent: 2001-42785 (2001-02-01), None
patent: 2001-223243 (2001-08-01), None
NA84035027 “Low Inductance Chip Tester Interposers” IBM Technical Disclosure Bulletin, Mar. 1984, US vol. # 26, Issue # 10A, p. # 5027-5030; Publication date Mar. 1, 1984.
Communication from Chinese Patent Office regarding counterpart application.
Communication from European Patent Office regarding counterpart application.

Affiliated with

Also associated with

Rating

Semiconductor device mounting method, semiconductor device... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device mounting method, semiconductor device..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device mounting method, semiconductor device... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3832558