Semiconductor device mounted upon an insulating adhesive with si

Details Semiconductor device mounted upon an insulating adhesive with si Semiconductor device mounted upon an insulating adhesive with si

1990-12-14

1992-05-12

James, Andrew J.

357 75, 357 80, H01L 2328, H01L 2316, H01L 3902

Patent

active

051132419

ABSTRACT:
A semiconductor device comprises a plurality of pellets fixed on a bed by a conductive adhesive agent, an insulating substrate having a junction wiring fixed on the bed between the semiconductor pellets, and wires for connecting the pellets and insulating substrate. The insulating substrate is fixed on the bed by an insulating adhesive agent including filling material such as particles of silicon dioxide and metal particles. The surfaces of the filling material particles are coated with an oxide film.

REFERENCES:
patent: 3753056 (1973-08-01), Cooke
patent: 4739389 (1988-04-01), Goedbloed
patent: 4907068 (1990-03-01), Amann et al.
patent: 4984065 (1991-01-01), Sako

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