Semiconductor device mounted on and electrically connected...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

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Details

C257S779000, C257S784000, C257SE23020, C361S761000

Reexamination Certificate

active

11145176

ABSTRACT:
The invention provides a package type semiconductor device and a manufacturing method thereof where reliability is improved without increasing a manufacturing cost. A resin layer and a supporting member are formed on a top surface of a semiconductor substrate formed with pad electrodes. Then, openings are formed penetrating the resin layer and the supporting member so as to expose the pad electrodes. Metal layers are then formed on the pad electrodes exposed in the openings, and conductive terminals are formed thereon. Finally, the semiconductor substrate is separated into semiconductor dice by dicing. When this semiconductor device is mounted on a circuit board (not shown), the conductive terminals of the semiconductor die and external electrodes of the circuit board are electrically connected with each other.

REFERENCES:
patent: 6630736 (2003-10-01), Ignaut
patent: 2002/0100986 (2002-08-01), Soga et al.
patent: 2002/0113323 (2002-08-01), Nakanishi et al.
patent: 2005/0046035 (2005-03-01), Egawa
patent: 2001-223288 (2001-08-01), None
patent: 2002-512436 (2002-04-01), None
patent: WO-99/40624 (1999-08-01), None

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