Semiconductor device, module for optical devices, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

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Details

C257S621000, C257S698000, C257S434000, C257SE23011

Reexamination Certificate

active

11038420

ABSTRACT:
An image pickup element and a micro-lens part are formed on the front surface of a semiconductor substrate; through electrodes passing through the semiconductor substrate are formed; protruding parts protruding from the front surface toward a glass lid are formed in a thickness greater than the thickness of the micro-lens part on the through electrodes; and the protruding parts are interposed between the semiconductor substrate and the glass lid.

REFERENCES:
patent: 2002/0019069 (2002-02-01), Wada
patent: 2004/0077121 (2004-04-01), Maeda et al.
patent: 2001-351997 (2001-12-01), None
patent: 2002-94082 (2002-03-01), None
patent: 2002-329852 (2002-11-01), None

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