Semiconductor device, method of manufacturing thereof,...

Details Semiconductor device, method of manufacturing thereof,... Semiconductor device, method of manufacturing thereof,...

2006-10-31

2006-10-31

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S780000, C257S781000, C257S784000, C257S693000, C257S738000

Reexamination Certificate

active

07129581

ABSTRACT:
A semiconductor device is provided comprising: a semiconductor element including a plurality of electrodes; a plurality of resin layers; a plurality of wirings; and a plurality of external terminals coupled to the wirings. First wirings of the plural wirings are formed at the bottom of a first resin layer and second wirings are formed at the top of the first resin layer.

REFERENCES:
patent: 5604379 (1997-02-01), Mori
patent: 5726489 (1998-03-01), Matsuda et al.
patent: 5753974 (1998-05-01), Masukawa
patent: 6054773 (2000-04-01), Ohsawa et al.
patent: 6175153 (2001-01-01), Yamada
patent: 6344696 (2002-02-01), Nakamura et al.
patent: 6512298 (2003-01-01), Sahara et al.
patent: 6515371 (2003-02-01), Akiyama et al.
patent: 6841873 (2005-01-01), Yoshida et al.
patent: 6987031 (2006-01-01), Eng et al.
patent: 2001/0020737 (2001-09-01), Kwon et al.
patent: 2004/0169287 (2004-09-01), Honda
patent: 0917 195 (1999-05-01), None
patent: 1198 003 (2002-04-01), None
patent: 11-26634 (1999-01-01), None
patent: WO 98/25297 (1998-06-01), None
patent: WO 98/25298 (1998-06-01), None
patent: WO 00/55898 (2000-09-01), None
Examination result issued in corresponding Chinese Patent application.

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