Semiconductor device, method of manufacturing the same, and...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S151000, C438S301000, C257S336000

Reexamination Certificate

active

11168857

ABSTRACT:
The present invention is directed to a method of manufacturing a semiconductor device including a semiconductor layer having a heavily doped source region, a heavily doped drain region, a lightly doped source region, a lightly doped drain region and a channel region, and a gate electrode opposite to the semiconductor layer with an insulating layer interposed therebetween. The method includes forming a semiconductor film on a substrate, forming a resist on the semiconductor film such that a first portion of the resist corresponding to the heavily doped source region and the heavily doped drain region is thinner than a second portion of the resist corresponding to the lightly doped source region, the lightly doped drain region and the channel region. In addition, the method includes forming the heavily doped source region and the heavily doped drain region by etching the semiconductor film in a predetermined pattern using the resist as a mask and injecting high density impurities into the semiconductor film through the first portion of the resist, removing the resist from the semiconductor film to form a gate insulating layer on the semiconductor film. Further, the method includes forming the gate electrode at a position on the gate insulating layer which corresponds to the channel region, and forming the lightly doped source region and the lightly doped drain region by injecting impurities having a density lower than the density of the high density impurities into the semiconductor film using the gate electrode as a mask.

REFERENCES:
patent: 6049092 (2000-04-01), Konuma et al.
patent: 6133074 (2000-10-01), Ishida et al.
patent: 6617644 (2003-09-01), Yamazaki et al.
patent: 6867431 (2005-03-01), Konuma et al.
patent: 7172928 (2007-02-01), Yamazaki
patent: 2002/0025591 (2002-02-01), Ohnuma et al.
patent: 2002/0134983 (2002-09-01), Yamazaki
patent: 2002-151523 (2002-05-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device, method of manufacturing the same, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, method of manufacturing the same, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device, method of manufacturing the same, and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3928066

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.