Semiconductor device, method of making the same, circuit...

Details Semiconductor device, method of making the same, circuit... Semiconductor device, method of making the same, circuit...

2005-03-15

2005-03-15

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S111000, C438S127000

Reexamination Certificate

active

06867068

ABSTRACT:
This is a semiconductor device made by using a film carrier tape and method of making the same, wherein the package size is close to the chip size and connection portions for electrodes of a semiconductor chip are not exposed. Electroplating is performed in a state where connection leads24, plating leads26and plating electrodes28are all conductive, the connection leads being are formed within a region to be filled with a molding material36and being connected to electrodes42of a semiconductor chip40and pad portions22, the plating leads26being connected to the connection leads24, and plating electrodes28being connected to the plating leads26. The connection portions29are punched out into the region to be filled with the molding material, the connection leads24and the electrodes42are connected, and the molding material36is poured in. The end surfaces of the connection leads24that are exposed from the holes32are also covered by the molding material36so as not to be exposed.

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