Semiconductor device, method for the same, and heat radiator

Details Semiconductor device, method for the same, and heat radiator Semiconductor device, method for the same, and heat radiator

2011-07-12

2011-07-12

Arora, Ajay K (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S122000, C257S707000, C257S704000, C257S712000, C257SE23101

Reexamination Certificate

active

07977162

ABSTRACT:
A semiconductor device includes a semiconductor chip, and a multicomponent alloy layer formed on a face of the semiconductor chip, the multicomponent alloy layer being in a solid-liquid coexisting state in a specific temperature range, and including a surface having concavity and convexity caused by solidification segregation.

REFERENCES:
patent: 5729052 (1998-03-01), Tonti et al.
patent: 2001/0032719 (2001-10-01), Kim et al.
patent: 2006/0038283 (2006-02-01), Su et al.
patent: 2004-332017 (2004-11-01), None
patent: 2006-222406 (2006-08-01), None
patent: 2007-035687 (2007-02-01), None

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