Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-06-13
2006-06-13
Nguyen, Ha Tran (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S639000, C438S678000, C438S692000
Reexamination Certificate
active
07060618
ABSTRACT:
The present invention relates to a semiconductor device and a method for manufacturing the same. The semiconductor device has an embedded interconnect structure in which an electric conductor, such as copper or silver, is embedded in fine recesses formed in a surface of a semiconductor substrate, and also has a protective film formed on surfaces of exposed interconnects that define the interconnect structure, to protect the interconnects. The protective film has a flattened surface.
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Inoue Hiroaki
Kanayama Makoto
Kimura Norio
Matsumoto Moriji
Wang Xinming
Ebara Corporation
Nguyen Ha Tran
Wenderoth , Lind & Ponack, L.L.P.
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