Semiconductor device, method for manufacturing the same,...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor

Reexamination Certificate

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Details

C257S774000, C257S777000, C257SE23011, C438S667000

Reexamination Certificate

active

10844419

ABSTRACT:
The invention provides highly reliable semiconductor devices, methods for manufacturing the same, circuit substrates and electronic devices. A semiconductor substrate is provided that includes: an integrated circuit and a pad defining a through hole electrically connected to the integrated circuit. A convex section is formed at a first surface where the pad is formed in a region that overlaps the through hole in the semiconductor substrate. A dielectric layer is formed on an inner surface of the convex section. An electrical connection section is provided having a conductive section disposed inside the dielectric layer and a wiring section disposed on the first surface to be electrically connected to the conductive section. An end surface of the conductive section is exposed through a second surface of the semiconductor substrate on the opposite side of the first surface.

REFERENCES:
patent: 5767001 (1998-06-01), Bertagnolli et al.
patent: 2002/0190375 (2002-12-01), Mashino et al.
patent: 2003/0129814 (2003-07-01), Mizukoshi
patent: A 60-098654 (1985-06-01), None
patent: A 08-510360 (1996-10-01), None
patent: 2000-311982 (2000-11-01), None
patent: 2001-44197 (2001-02-01), None
patent: A 2001-53218 (2001-02-01), None
patent: A-2001-135780 (2001-05-01), None
patent: A-2003-282819 (2003-10-01), None

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