Semiconductor device metal programmable pooling and dies

Details Semiconductor device metal programmable pooling and dies Semiconductor device metal programmable pooling and dies

2011-02-01

2011-02-01

Levin, Naum B (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C716S030000, C326S039000, C257S758000, C714S725000

Reexamination Certificate

active

07882453

ABSTRACT:
A pool of die designs includes die designs having metal programmable base layers. Die designs from the pool are selected for use in fabricating dies. Die designs are added to the pool by customization of die designs already in the pool or by preparing custom die designs that incorporate a metal programmable base layer. In some embodiments multi-tile dies are provided with I/O slots configurable for either inter tile communication or inter die communication.

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