Semiconductor device manufacturing method, semiconductor...

Details Semiconductor device manufacturing method, semiconductor... Semiconductor device manufacturing method, semiconductor...

2011-01-11

2011-01-11

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S114000, C438S460000, C438S465000

Reexamination Certificate

active

07867829

ABSTRACT:
There is provided a semiconductor device manufacturing method which prevents cracking of an overcoat during polishing process, and a semiconductor wafer and a semiconductor device which have an overcoat free from cracking. A plurality of divided overcoats10are formed on each chip3in a chip region2and on each unavailable chip pattern in an unavailable region in the periphery of the chips3on the surface of a semiconductor wafer1, and the semiconductor wafer1is mounted upside down on a table with an intervening film so that the back surface of the semiconductor wafer1is polished.

REFERENCES:
patent: 59-229829 (1984-12-01), None
patent: 64-69013 (1989-03-01), None
patent: 11-340268 (1999-12-01), None
patent: 2006-32482 (2006-02-01), None

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