Semiconductor device manufacturing method and substrate...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S787000, C438S791000, C257SE21278

Reexamination Certificate

active

07858534

ABSTRACT:
A semiconductor device manufacturing method comprises a process of forming a film on each of multiple substrates arrayed in a processing chamber by a thermal CVD method by supplying a film forming gas into the processing chamber while heating the interior of the processing chamber, wherein in the film forming process, a cycle is performed one time or multiple times with one cycle including a step of flowing the film forming gas from one end towards the other end along the substrate array direction, and a step of flowing the film forming gas from the other end towards the one end along the substrate array direction, without forming temperature gradient along the substrate array direction in the processing chamber.

REFERENCES:
patent: 7122085 (2006-10-01), Shero et al.
patent: 2002/0170674 (2002-11-01), Shapiro
patent: 2004/0250773 (2004-12-01), Hasegawa et al.
patent: 2005/0072357 (2005-04-01), Shero et al.
patent: 2007/0079525 (2007-04-01), Sogard
patent: 2009/0218045 (2009-09-01), Hiroshima et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device manufacturing method and substrate... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device manufacturing method and substrate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device manufacturing method and substrate... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4216434

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.