Semiconductor device manufacturing apparatus employing vacuum sy

Material or article handling – Apparatus for moving material between zones having different... – For carrying standarized mechanical interface type

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414939, B65G 4900

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active

058334254

ABSTRACT:
An apparatus for manufacturing a semiconductor device by employing a vacuum system is provided. A heating source is installed in a predetermined portion of a venting-gas inlet. A venting-speed controlling valve is installed in a predetermined portion of an exhaust pipe, for controlling the speed of gas flowing from a load lock chamber to a pump by controlling the opening and closing thereof. An exhaust pipe may have a main pipe with different diameters in different portions to reduce the venting speed. Accordingly, condensation-induced particle formation can be reduced by thus preventing adiabatic expansion of the gas in a load lock chamber.

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Benjamin Yan Ye et al., "Condensation-Induced Particle Formation During Vacuum Pump Down", Journal of the Electrochemical Society, vol. 140, No. 5, pp. 1463-1468, May 1993).

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