Semiconductor device manufacturing apparatus and method with opt

Details Semiconductor device manufacturing apparatus and method with opt Semiconductor device manufacturing apparatus and method with opt

1994-09-20

1996-07-16

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 216 60, H01L 2100

Patent

active

055363598

ABSTRACT:
A semiconductor device manufacturing apparatus and its method, measures the amount or chemical composition of reaction products adhering to or deposited on the inside of a processing chamber of the semiconductor device manufacturing apparatus, without exposing the chamber to the air. External light, such as infrared light, is introduced from a light introducing unit into the processing chamber. A light receiving unit provided outside the processing chamber receives light reflected from a specified location inside the processing chamber or light reflected from an arbitrary location inside the chamber. The received light is then subjected to spectrometry or photometry to judge how badly the chamber is contaminated and to judge the state of the process being carried out.

REFERENCES:
patent: 4328068 (1982-05-01), Curtis
patent: 5232537 (1993-08-01), Yachi
patent: 5362969 (1994-11-01), Glenn
"Fourier Transform Infrared Studies of Polyimide and Poly(methyl-methacrylate) Surfaces During Downstream Microwave Plasma Etching", J. Leu et al, 8257 a Journal of Vacuum Science & Technology, Nov./Dec. 1991, No. 6, New York, US, pp. 2948-2962.
Barner et al., "Polarization Modulation Fourier Transform Infrared Reflectance Measurements of Thin Films and Monolayers at Metal Surfaces Utilizing Real-Time Sampling Electronics", Anal. Chem., 1991, No. 63, pp. 55-60.
Mattson Instruments Research Laboratories, "Mid-Infrared Fiber Optics", Mar. 1992.
Suetaka, "Surface Infrared and Raman Spectroscopy", IPC, Nov. 30, 1990, from p. 7.

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